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Cleaning machine×テクニカルフィット - List of Manufacturers, Suppliers, Companies and Products

Cleaning machine Product List

1~9 item / All 9 items

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Cassette box cleaning device

Cleaning difficult-to-wash uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.

This is a cleaning device that performs cleaning of various carriers (cassettes) using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. *For more details, please contact us or download and view the catalog.*

  • Other semiconductor manufacturing equipment
  • Other cleaning machines
  • Ultrasonic Cleaner

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Box cleaning device

Cleaning difficult-to-wash uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.

This is a cleaning device that performs the cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling both the cleaning and drying processes. *For more details, please contact us or download the catalog to view it.*

  • Other semiconductor manufacturing equipment
  • Other cleaning machines
  • Ultrasonic Cleaner

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FOUP cleaning device

Cleaning difficult-to-wash uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.

This is a cleaning device that performs the cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. 【Features】 ■ Cleaning adapted to complex shapes such as hoops ■ Automation of the cleaning process ensures stable cleaning effectiveness *For more details, please contact us or download the catalog to view.

  • Other semiconductor manufacturing equipment
  • Other cleaning machines
  • Ultrasonic Cleaner

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Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc., 2 to 6 inches)

A scrub cleaning device that allows for transportation and drying without touching the front and back of the workpiece! In addition to simultaneous cleaning of the front, back, and sides with a unique mechanism, it also supports combinations with ultrasonic showers and more.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It enables transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Supports transparent wafers as well *For more details, please contact us or download the catalog to view.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

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LT・SiC and other 2 to 6-inch small diameter wafer double-sided simultaneous chemical scrub cleaning device

A chemical cleaning device that enables transportation and drying without touching the front and back of the workpiece, as well as the removal of foreign substances and metal contamination! It also supports a combination with brush cleaning using the chemical solution.

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, followed by chemical spray, megasonic spot shower, and spin drying. It is capable of removing stubborn contaminants and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edge as an option. ■ Simultaneous cleaning of both sides ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameter: φ2” to φ4”, thickness negotiable ■ Supports transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

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FOSB cleaning device

Cleaning difficult-to-clean uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.

This is a cleaning device that performs cleaning of various FOSBs using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. *For more details, please contact us or download the catalog to view it.*

  • Other semiconductor manufacturing equipment
  • Other cleaning machines
  • Ultrasonic Cleaner

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Wafer cleaning device "Double-sided brush cleaning device (mass production type)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the workpiece.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneously, edge scrubbing and cleaning are also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

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Wafer cleaning device "Double-sided scrub cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Wafer types to be cleaned: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

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Wafer cleaning device "Double-sided brush cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transportation, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

Added to bookmarks

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